Kogukond
Kas soovite näha teiste kasutajate teavet selle toote kohta?
Lugege meie kogukonnaliikmete arutelusid, ajaveebe, dokumente.SAMSUNG ELECTRO MECHANICS
Teave tootja SAMSUNG ELECTRO MECHANICS kohta
Teave SAMSUNG
Samsung Electro-Mechanics has played a central role in the global history of the electric and electronic parts industry. They are an industry-leading manufacturer of passive electronic components, like MLCCs, printed circuit boards, and modules – based on materials, multilayer thin-film deposition, and circuit technology. Samsung’s goal is to become the world’s top manufacturer of passive components.
Samsung Electro-Mechanics has led the development of the electronic component business by continuously advancing passive component technology. With its differentiated converged technology and innovative techniques, Samsung will continuously find and foster future business in cutting edge applications for the automotive industry,the Internet of Things, 5G and more.
Featured Products | ||
|---|---|---|
 CL Series X5R Mulitlayer Ceramic CapacitorsOperating Temperature Max: 85°C, Monolithic structure for high reliability, Excellent DC-Bias characteristics, Free of all RoHS-regulated substances, Finer-grain BaTiO3 powder synthesis technology, Nano (<100㎚) fine powder distribution technology, Dielectric ultrathin-film molding technology and High-resolution internal electrode forming technology. |  CL Series X7R Mulitlayer Ceramic CapacitorsOperating Temperature Max: 125°C , Monolithic structure for high reliability, Excellent DC-Bias characteristics, Free of all RoHS-regulated substances, Finer-grain BaTiO3 powder synthesis technology, Nano (<100㎚) fine powder distribution, technology, Dielectric ultrathin-film molding technology and High-resolution internal electrode forming technology. |  CL Series C0G/NP0 Mulitlayer Ceramic CapacitorsOperating Temperature Max: 125°C, Monolithic structure for high reliability, Excellent DC-Bias characteristics, Free of all RoHS-regulated substances, Finer-grain BaTiO3 powder synthesis technology, Nano (<100㎚) fine powder distribution technology, Dielectric ultrathin-film molding technology and High-resolution internal electrode forming technology. |