Collect - Edge Devices (Sensors & Actuators)

This is the front-most device of any IoT system. It primarily works as either a sensing device to collect physical environment information, or as an actuator to control the outside world with an output. In some cases, edge devices perform a dual role, acting as both a sensing and actuating device to collect and control the physical environment.


The edge node must be connected to the outside network, either through a wired or wireless sensor node (WSN). Data integrity remains key in this block of the signal chain as many IoT systems utilize a large number of sensors to collect data and make intelligent decisions.


An edge node device provides the intelligence to sense, measure, interpret, and connect an internet gateway to the cloud. The data can be pre-processed with some form of analytics before it is transmitted for deeper data mining intelligence.


Processing nodes provides local intelligence to the entire network of sensors and applications. Typically, a processing node involves one or more microcontroller, microprocessor, hybrid circuit, etc. and may be relatively larger in size as compared to end-nodes. Processing nodes are not readily available devices; they are custom made by designers to meet the specific needs of their application.


Bigger IoT applications require a large array of edge devices in order to form a network of edge devices. In such cases, each edge device (node) needs to have a unique identifier in order to recognise and communicate with them effectively.


Typical examples of Edge Devices (Nodes):


Sensors: Temperature, Humidity, Pressure, Gas, Light, Sound, RFID, NFC, Ultrasonics, Flow Meter, Fluid, Cameras, etc


Actuators: Switch, Relays, PLCs, Motors, Light, Sound etc


Videos

TI IoT Week, Sensor Node Project

Smart Occupancy Sensor training video for IoT Solutions from Silicon Labs

Atmel: IoT-Enabled Temperature Sensor Demo

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Flick, 3D Tracking and Gesture Sensor, HAT

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PIR Motion Sensors

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Development Kit, IoT Node, Low Power, Wi-Fi, BLE, NFC, 915 MHz (US), Connection to Cloud Servers

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MPU6000 DEV BOARD - Development Board, MPU6000 Triple Axis Gyroscope & Accelerometer, 6-Axis Motion Processing

2082446

Development Board, MPU6000 Triple Axis Gyroscope & Accelerometer, 6-Axis Motion Processing

INVENSENSE

MPU6000, GYRO, I2C, SPI, EVAL BOARD; Kit Application Type:Sensor; Silicon Manufacturer:-; Silicon Core Number:-; Application Sub Type:Triple Axis Gyroscope & Accelerometer; Kit Contents:MPU-6000 Digital Motion Processing Unit and the AKM Compass; Product

15 Laos

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MAX31855PMB1#
MAX31855PMB1# - Evaluation Module, MAX31855 K-Type Thermocouple to Digital Converter, 14-Bit Output

2530496

Evaluation Module, MAX31855 K-Type Thermocouple to Digital Converter, 14-Bit Output

MAXIM INTEGRATED PRODUCTS

DEV BOARD, THERMOCOUPLE-DIGITAL; Kit Application Type:Sensing - Temperature; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX31855; Application Sub Type:Thermocouple to Digital Converter; Kit Contents:Dev Board MAX31855( K Type The

43 Laos

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4 laos järgmisel päeval kohaletoimetamiseks (ladu: UK): 00 (ümberkeritud toodetele 18:30) E–R (välja arvatud riiklikel pühadel)

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2011660
2011660 - Evaluation Module, Laser Diode Driver, Integrated Reverse Polarity Protection for IC & Laser Diode

1272670

Evaluation Module, Laser Diode Driver, Integrated Reverse Polarity Protection for IC & Laser Diode

LASER COMPONENTS

LASER DIODE DRIVER, DEV KIT; Kit Application Type:Drivers; Silicon Manufacturer:Laser Components; Silicon Core Number:-; Application Sub Type:Laser Diode Driver; Kit Contents:Evaluation Board WK Module; Product Range:-; SVHC:No SVHC (15-Jan-2019); Featur

86 Laos  
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AMG8834EK
AMG8834EK - Evaluation Board, AMG8834 Infrared Grid-EYE Array Sensor, PAN1740 Bluetooth Low Energy Module

2664539

Evaluation Board, AMG8834 Infrared Grid-EYE Array Sensor, PAN1740 Bluetooth Low Energy Module

PANASONIC

GRID-EYE SENSOR BOARD; Kit Application Type:Sensor; Silicon Manufacturer:Panasonic; Silicon Core Number:AMG8834; Application Sub Type:Infrared Array Sensor; Kit Contents:Grid-EYE Sensor Board, ATSAMD21- SMART, Bluetooth Module; Product Range:-; SVHC:No S

21 Laos  
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EVAL-ADXL377Z
EVAL-ADXL377Z - Breakout Board, ADXL377 3-Axis High g Analog MEMS Accelerometer

2250738

Breakout Board, ADXL377 3-Axis High g Analog MEMS Accelerometer

ANALOG DEVICES

EVALUATION BOARD, 3 AXIS ACCEL; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Analog Devices; Silicon Core Number:ADXL377; Application Sub Type:Accelerometer - Three-Axis; Kit Contents:Evaluation Board ADXL377; Product Range:A

27 Laos  
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SEK001
SEK001 - Evaluation Kit, Trustability Pressure Sensors, Digital Output

2772519

Evaluation Kit, Trustability Pressure Sensors, Digital Output

HONEYWELL

SENSOR EVALUATION KIT, PRESSURE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Honeywell; Silicon Core Number:-; Application Sub Type:Board Mount Pressure Sensors; Kit Contents:Sensor Evaluation Kit; Product Range:-; SVHC:No SVHC (07-Jul-2017)

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HDC1000EVM
HDC1000EVM - Evaluation Module, Sensor, Temperature & Humidity, Complete HR & Temperature Data Logger

2451102

Evaluation Module, Sensor, Temperature & Humidity, Complete HR & Temperature Data Logger

TEXAS INSTRUMENTS

EVAL BOARD, HDC1000 TEMP/HUMIDITY SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, HDC1000; Application Sub Type:Temperature Sensor & Humidity Sensor; Kit Contents:Eval Board HDC1000; Product R

22 Laos

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BRKT-STBC-AGM01
BRKT-STBC-AGM01 - Development Platform, FXAS21002C & FXOS8700C 9-Axis Solution, Sensor Shield and Breakout Board

2473788

Development Platform, FXAS21002C & FXOS8700C 9-Axis Solution, Sensor Shield and Breakout Board

NXP

BREAKOUT BOARD, FREEDOM INERTIAL SENSOR; Silicon Manufacturer:NXP; Core Architecture:ARM; Core Sub-Architecture:Cortex-M4; Silicon Core Number:FXAS21002C, FXOS8700CQ; Silicon Family Name:-; For Use With:NXP FRDM-K64F-AGM01 Demonstration kit; Kit Contents

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FRDM-FXS-MULT2-B
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2520442

Evaluation Module, MMA8652FC/FXAS21002C/MPL3115A2 3-Axis Accelero/Magneto/Gyroscope

NXP

DEV BOARD, FREEDOM PLATFORM; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:NXP; Silicon Core Number:FXLS8471Q, MAG3110, FXAS21002C, MMA8652FC, MPL3115A2, FXOS8700CQ, MMA9553L; Application Sub Type:Sensor; Kit Contents:Freedom

39 Laos

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OM13081UL
OM13081UL - Evaluation Module, LPC82x Capacitive Touch Solution, 8-Bit Touchpad, 9 Keys, LCD

2471049

Evaluation Module, LPC82x Capacitive Touch Solution, 8-Bit Touchpad, 9 Keys, LCD

NXP

DEMO BOARD, CAP TOUCH SOLUTION; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:NXP; Silicon Core Number:LPC824; Application Sub Type:Capacitive Touch; Kit Contents:Dev Board LPC824, LPC82x Touch Shield, USB Cable; Product Range:-;

56 Laos

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XTRINSIC-SENSORS-EVK
XTRINSIC-SENSORS-EVK - Evaluation Kit for NXP Xtrinsic Sensors using FRDM-KL25Z Platform

2308734

Evaluation Kit for NXP Xtrinsic Sensors using FRDM-KL25Z Platform

NXP

EVAL KIT, XTRINSIC SENSOR + KL25 BOARD; Kit Application Type:Sensing - Sampling Kit / Related Components; Silicon Manufacturer:NXP; Silicon Core Number:KL25Z, MAG3110, MMA8491, MPL3115; Application Sub Type:-; Kit Contents:Xtrinsic Sensor Board, Freedom

605 Laos

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SENSEKIT2-EVK-101
SENSEKIT2-EVK-101 - Evaluation Kit, LAPIS MCU, 6x Analog and Digital Ambient Light Sensor IC's, Hot Pluggable Design

2475523

Evaluation Kit, LAPIS MCU, 6x Analog and Digital Ambient Light Sensor IC's, Hot Pluggable Design

ROHM

EVAL BOARD, ML610Q112 SENSOR PLATFORM; Kit Application Type:Sensor; Silicon Manufacturer:-; Silicon Core Number:ML610Q112, BU52011HFV, BH1620FVC, BH1721FVC, ML8511, KMX61, BDE0600G; Application Sub Type:Embedded; Kit Contents:Sensor Platform Base Board,

14 Laos

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MAXREFDES117#
MAXREFDES117# - Reference Design Board, Optical Heart Rate and Pulse-Oximetry Monitor, Integrated Red and IR LEDs

2627165

Reference Design Board, Optical Heart Rate and Pulse-Oximetry Monitor, Integrated Red and IR LEDs

MAXIM INTEGRATED PRODUCTS

REF DES BRD, HEART RATE/PULSE OXIMETER; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX30102, MAX14595, MAX1921; Kit Application Type:Sensor; Application Sub Type:Pulse Oximeter & Heart Rate Monitor; Core Architecture:-; Core Sub-

5 Laos

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DM160225
DM160225 - Evaluation Board, PC Peripheral, 3DTouchPad, Extends 2D Touch Pad with 3D Gestures

2448429

Evaluation Board, PC Peripheral, 3DTouchPad, Extends 2D Touch Pad with 3D Gestures

MICROCHIP

DEV BOARD, PCAP SENSOR 3D TOUCH PAD; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Microchip; Silicon Core Number:MTCH63104, MGC3130; Application Sub Type:3D Tracking & Gesture Controller; Kit Contents:3DTouchPad, USB Cable, Infor

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LDC1000EVM
LDC1000EVM - Evaluation Module, LDC1000 Inductance to Digital Converter for Inductive Sensing Applications, 5V

2360423

Evaluation Module, LDC1000 Inductance to Digital Converter for Inductive Sensing Applications, 5V

TEXAS INSTRUMENTS

INDUCTIVE SENSING, EVALUATION BOARD; Kit Application Type:Data Converter; Silicon Manufacturer:Texas Instruments; Silicon Core Number:LDC1000; Application Sub Type:Inductance to Digital Converter; Kit Contents:Evaluation Board LDC1000; Product Range:-; S

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FDC2114EVM .
FDC2114EVM . - Evaluation Module, FDC2114 12-Bit Capacitive Sensing Solution, Proximity Sensing, 4 Channel

2535921

Evaluation Module, FDC2114 12-Bit Capacitive Sensing Solution, Proximity Sensing, 4 Channel

TEXAS INSTRUMENTS

EVAL BOARD, FDC2114 CAP-TO-DIGITAL CONV; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, FDC2114; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Evaluation Boa

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LDC1614EVM .
LDC1614EVM . - Evaluation Module, LDC1614 28-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

2471703

Evaluation Module, LDC1614 28-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

TEXAS INSTRUMENTS

EVAL BOARD, LDC1614; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, LDC1614; Application Sub Type:Sensor; Kit Contents:Eval Board LDC1314; Product Range:-; SVHC:No SVHC (27-Ju

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OPT3001EVM .
OPT3001EVM . - Evaluation Module, OPT3001 Ambient Light Sensor, Digital Output Integrated Circuit

2471704

Evaluation Module, OPT3001 Ambient Light Sensor, Digital Output Integrated Circuit

TEXAS INSTRUMENTS

EVALUATION BOARD, LIGHT SENSOR; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:OPT3001; Application Sub Type:Light to Digital Converter; Kit Contents:Eval Board OPT3001, SM-USB DIG Board,

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FDC1004QEVM .
FDC1004QEVM . - Evaluation Module, FDC1004-Q1 Automotive 4-Channel Capacitive to Digital Converter, Plug & Play

2535928

Evaluation Module, FDC1004-Q1 Automotive 4-Channel Capacitive to Digital Converter, Plug & Play

TEXAS INSTRUMENTS

EVAL BRD, FDC1004-Q1 CAP-TO-DIGITAL CONV; Kit Application Type:Sensor Signal Conditioner; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528IRGCT, FDC1004-Q1; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Eval B

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ADPD105BCPZ
ADPD105BCPZ - PHOTOMETRIC FRONT END, LFCSP-28

2725084

PHOTOMETRIC FRONT END, LFCSP-28

ANALOG DEVICES

PHOTOMETRIC FRONT END, LFCSP-28; IC Function:Photometric Front End; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; IC Package Type:LFCSP; No. of Pins:28Pins; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product Range:-; MSL:MSL 3 -

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EK-H5
EK-H5 - Evaluation Kit for SHT2x and SHT7x Humidity and Temperature Sensors

1855471

Evaluation Kit for SHT2x and SHT7x Humidity and Temperature Sensors

SENSIRION

EVALUATION KIT, HUMIDITY, FOR SHT2X/7X; Kit Application Type:Sensor; Silicon Manufacturer:Sensirion; Silicon Core Number:SHT21; Application Sub Type:Humidity Sensor; Kit Contents:EK-H5 USB Stick, SHT21 Sensor, Sensor Cable; Product Range:-; SVHC:No SVHC

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SI7057-EVB
SI7057-EVB - Evaluation Kit, Si705x Processor Family, Temperature Sensor, USB Dongle Form Factor

2769165

Evaluation Kit, Si705x Processor Family, Temperature Sensor, USB Dongle Form Factor

SILICON LABS

EVAL BOARD, DIGITAL TEMPERATURE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Silicon Laboratories; Silicon Core Number:Si7057, Si7058 & Si7059; Application Sub Type:Temperature Sensor; Kit Contents:USB Dongle Control & Si7057-EB Postage Stam

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