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DEVCON  21500  Adhesive, Devweld, Epoxy - 2 Part, Syringe, White / Yellow, 50 ml

DEVCON 21500
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Toote ülevaade

The 21500 is a two-part 1:1 ratio methacrylate Adhesive designed for structural bonding of thermoplastic, metal and composite assemblies. Devweld 531 is particularly well suited for bonding thermoplastic materials and combines high strength and stiffness with the ability to adhere difficult-to-bond materials. It is in the form of white paste with slightly pungent odour.
  • 100.5°C Boiling point
  • 0.93 to 1.05 Relative density
  • 3.5 Vapour density
  • 28mm hg Vapour pressure
  • 3 Evaporation rate
  • 10°C Flash point

Tooteteave

Adhesive Type:
Epoxy - 2 Part
Dispensing Method:
Syringe
Adhesive Colour:
White / Yellow
Volume:
50ml
Weight:
-
Product Range:
-
Heat Up Time:
30 min
Material:
Methacrylate Adhesive
Mix Ratio:
1:1
Operating Temperature Min:
-55 °C
Fully Hardened:
24 hrs
Mix Ratio by Volume:
1:1
Viscosity Max:
60000
Cure Time Max:
24 h
Shelf Life:
1 Yr
Tensile Strength:
27 - 31
Viscosity Min:
40000
Operating Temperature Max:
120 °C
Cure Time Min:
15 min
Full Strength Cure Time:
24 h
Adhesive Applications:
Bonding, General Purpose
SVHC:
No SVHC (15-Jun-2015)

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Rakendused

  • Industrial;
  • Maintenance & Repair

Seadusandlus ja keskkonnateave

Päritoluriik:
United States

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RoHS-ile vastav:
Jah
Tariifi nr:
32141010
UN Riski Kood:
1133
Kaal (kg):
.075

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